Solutions

Apaltek Shenzhen Co.,Ltd.was founded in 2010, With a high-quality provider of the thermal management solutions which has integrated in R&D, manufacturing, selling and servicing, and leading position in semicoductor of CPU GPU

Constructure Parts

C J assembly series

C J Series disassembled parts

C J series water block

Key material

Radiator assembly performs the vacuum brazing process and confirms no leaking and being polluted

The pump material is imported from Japan brand Baoli PPS in a high-temperature resistant plastic, And ceramic bearing with a speed of 3000±10% RPM

Pump speed reaches up to 3000±10% RPM and use ceramic bearing and noiseless

All aluminum alloy outer shell has been used in a wire drawn process and top cover uses in a high strength acrylic

Using industrial three layers level of mesh seal technique and low permeability water pipes

Radiator assembly performs the vacuum brazing process and confirms no leaking and being polluted

Key material

Motherboard + CPU modelModelCJS-360-1#CJS-360-2#CJS-360-3#CJS-360-4#
Platform machine test dataROG STRIX Z790-A GAMING WIFI D4 & Intel i9-13900K Core CPU ProcessorCPU Power(W)260.83262.74260.71261.76
speed of the fan(RPM)2200220023002200
CPU average temperature (℃)77.36 78.08 78.36 78.28 
Ambient temperature(℃)24.924.92525.1
Temperature difference(℃)52.46 53.18 53.36 53.18 
Package85858686
CPU core temperature (℃)CORE#084868787
CORE#175777675
CORE#278788080
Test DateTest time (min)CORE#379798180
CORE#481838384
 2023/1/1315CORE#580818182
CORE#684868686
CORE#778787978
CORE#885848585
CORE#975767675
CORE#1075767675
CORE#1175767675
CORE#1275767675
CORE#1377787878
CORE#1477787878
CORE#1577787878
CORE#1677787878
CORE#1774757575
CORE#1874757475
CORE#1974757475
CORE#2072757474
CORE#2177767777
CORE#2277767777
CORE#2377767777
CORE#2477767778

OCCT Real CPU Test - Intel i9-13900K Core CPU Processor

  • All the above tests did not activate the LED light source.
  • Select ‘OCCT’ as the test CPU pressure program.
  • This experiment was conducted in an open room temperature environment.
  • From the above results, it can be seen that the optimized CJS-360 has a 2-3 degree lower heat
  • dissipation performance than the pre optimized product.
Motherboard + CPU modelModelCJS-360-1#CJS-360-2#
Platform machine test dataAMD platform, CPU model: Ryzen 7950X, motherboard model: MSI X670-PCPU Power(W)203.5202.62
speed of the fan(RPM)22002200
CPU average temperature (℃)82.20 81.80 
Ambient temperature(℃)23.623.5
Temperature difference(℃)58.60 58.30 
Package82.281.8
CPU core temperature (℃)CORE#000
CORE#100
CORE#200
Test DateTest time (min)CORE#300
CORE#400
2023/1/1315CORE#500
CORE#600
CORE#700
CORE#800
CORE#900
CORE#1000
CORE#1100
CORE#1200
CORE#1300
CORE#1400
CORE#1500
CORE#1600

OCCT Real CPU Test - Intel i9-13900K Core CPU Processor

  • All the above tests did not activate the LED light source.
  • Select ‘Aida64’ as the CPU stress test program.
  • This experiment was conducted in an open room temperature environment.
  • From the above results, it can be seen that the optimized CJS-360 has a 2-3 degree lower heat dissipation
  • performance than the pre optimized product.

Constructure Parts

Explanation for China Patent Certificate

Explanation for Taiwan Patent Certificate

Application product

PC gaming series