Custom Liquid Cold Plates

Engineered liquid cold plates for AI servers, GPUs, data centers and industrial electronics — built to your drawings, from prototype to volume production.

  • Brazed Copper Construction
  • Skived, Microchannel & Pin Fin
  • DFM Review Before Quote
  • Reply Within 1 Business Day

Tell Us About Your Project

STEP or 2D drawings welcome. Our engineers reply within 1 business day.

Explore Our Cold Plate Designs

Browse reference designs by application and construction. Product suitability depends on your device, mounting layout and thermal requirements. Our team can also review custom drawings

FAQ

To quote a cold plate accurately, we need three things: the thermal requirements, the hydraulic conditions, and the mechanical constraints. Please send as much of the following as you have:

  • Drawings: a 3D model (STEP preferred) or 2D drawing of the device and the available envelope
  • Thermal: total heat load, power per heat source or a heat map, and the target case or junction temperature
  • Coolant: coolant type (DI water, PG25, EGW, etc.), inlet temperature, available flow rate, and maximum allowable pressure drop
  • Interface: mounting hole pattern, port location and connector type (barb, thread, or quick disconnect)
  • Commercial: prototype quantity, expected annual volume, and target schedule
  • Testing: any required leak, pressure, or reliability standards

If some data isn’t finalized yet, send what you have. Our engineers will work through the gaps with you.

Yes. APALTEK builds cold plates to customer drawings. Before we quote, our engineering team runs a manufacturability (DFM) review of the drawing. We flag anything that could affect cost, yield, flatness, or leak risk, such as channel geometry that doesn’t suit the joining process, tight tolerances, or port placement. You can have the part built exactly as drawn, or ask us to suggest optimizations that improve thermal performance or reduce pressure drop.

Start with an existing design if your device footprint, mounting pattern, heat load, and pressure-drop budget fall within the range of one of our standard cold plates. This is usually the faster, lower-cost route, with no new tooling and a proven structure.

Choose a custom design if you have:

  • A non-standard package or a multi-chip layout with uneven hot spots
  • A tight envelope or fixed port positions
  • A strict pressure-drop limit
  • Production volumes that justify optimizing cost and performance

Many projects fall in between. A standard cold plate with modified ports, mounting holes, or dimensions is often the best balance. Share your requirements and our engineers will recommend the right starting point.

Choose a custom design if you have:

  • A non-standard package or a multi-chip layout with uneven hot spots
  • A tight envelope or fixed port positions
  • A strict pressure-drop limit
  • Production volumes that justify optimizing cost and performance

Many projects fall in between. A standard cold plate with modified ports, mounting holes, or dimensions is often the best balance. Share your requirements and our engineers will recommend the right starting point.

Validation data depends on the project stage, and typically covers four areas:

  • Design stage: thermal and flow simulation results
  • Thermal performance: thermal resistance and device temperature at the specified power, flow rate, and inlet temperature
  • Hydraulics: pressure drop versus flow rate
  • Leak tightness and quality: helium leak testing, pressure testing, and dimensional and flatness inspection

If your project has its own qualification plan, such as pressure cycling, thermal cycling, or coolant compatibility tests, share it at the start. We’ll align the test scope and reporting with your requirements.

Before confirming that a cold plate fits your device, we need to confirm:

  • Device model and package: exact chip, module, or socket type, contact surface size, and die or hot-spot locations
  • Mounting: hole pattern, retention or backplate hardware, and allowable mounting force
  • Clearance: Z-height limits and keep-out zones for surrounding components, and whether any other components also need cooling
  • Thermal interface: TIM type and thickness, plus the surface flatness and warpage requirements
  • Loop integration: port orientation, hose routing, connector type, operating pressure, and wetted materials in the rest of the coolant loop

Need a Cold Plate Built Around Your Device?

Share your drawing and project requirements for an engineering review.

Request a Quote

Complete the form below and our team will provide a customized quotation based on your project requirements. We’ll get back to you within 1 business day.