Solutions

Apaltek Shenzhen Co.,Ltd.was founded in 2010, With a high-quality provider of the thermal management solutions which has integrated in R&D, manufacturing, selling and servicing, and leading position in semicoductor of CPU GPU

Constructure Parts


 Apaltek

C J assembly series

 Apaltek

C J Series disassembled parts

 Apaltek

C J series water block

Advantage


C J series cold head structure

C J series cold head structure

C J series cold head waterway flow direction

Core Enlightenment

Core Enlightenment


 Apaltek

Inspired by the 3R System, Angpai continues to improve its liquid cooling technology; 3R System is a pioneering company in South Korea that previously held a patent for a similar structure (released on April 18, 2003 and expiring on November 15, 2016).

C J series cold head structure


 Apaltek

The C J series has two separable and functionally independent containers

C J series cold head waterway flow direction


 Apaltek

CJ water-cooled head water channel flow sequence IN 1 #~OUT 6#

Core Enlightenment


 Apaltek

The feature of Angpai's new water-cooled heat dissipation device is that it has two separable and functionally independent containers, including: The container (i.e. heat dissipation module, providing heat exchange function) includes a chamber seat and a heat absorbing structure connected to the chamber seat. The heat absorbing structure has a heat exchange chamber inside, and the chamber seat is equipped with a water supply channel connected to the heat exchange chamber. A water storage chamber is located in the water supply channel; A container (i.e. pump module, providing pump delivery function), comprising a chamber substrate and a pump fixed on the chamber substrate, the chamber substrate being flat on the chamber seat and having a pump tank and a pumping hole connected to the pump tank, the pump having a impeller accommodated in the pump tank, the pumping hole corresponding to the water storage chamber configuration and interconnected.

Key material


 Apaltek

Radiator assembly performs the vacuum brazing process and confirms no leaking and being polluted

 Apaltek

The pump material is imported from Japan brand Baoli PPS in a high-temperature resistant plastic, And ceramic bearing with a speed of 3000±10% RPM

 Apaltek

Pump speed reaches up to 3000±10% RPM and use ceramic bearing and noiseless

 Apaltek

All aluminum alloy outer shell has been used in a wire drawn process and top cover uses in a high strength acrylic

 Apaltek

Using industrial three layers level of mesh seal technique and low permeability water pipes

 Apaltek

Radiator assembly performs the vacuum brazing process and confirms no leaking and being polluted

Efficient performance


Motherboard + CPU model Model CJS-360-1# CJS-360-2# CJS-360-3# CJS-360-4#
Platform machine test data ROG STRIX Z790-A GAMING WIFI D4 & Intel i9-13900K Core CPU Processor CPU Power(W) 260.83 262.74 260.71 261.76
speed of the fan(RPM) 2200 2200 2300 2200
CPU average temperature (℃) 77.36  78.08  78.36  78.28 
Ambient temperature(℃) 24.9 24.9 25 25.1
Temperature difference(℃) 52.46  53.18  53.36  53.18 
Package 85 85 86 86
CPU core temperature (℃) CORE#0 84 86 87 87
CORE#1 75 77 76 75
CORE#2 78 78 80 80
Test Date Test time (min) CORE#3 79 79 81 80
CORE#4 81 83 83 84
 2023/1/13 15 CORE#5 80 81 81 82
CORE#6 84 86 86 86
CORE#7 78 78 79 78
CORE#8 85 84 85 85
CORE#9 75 76 76 75
CORE#10 75 76 76 75
CORE#11 75 76 76 75
CORE#12 75 76 76 75
CORE#13 77 78 78 78
CORE#14 77 78 78 78
CORE#15 77 78 78 78
CORE#16 77 78 78 78
CORE#17 74 75 75 75
CORE#18 74 75 74 75
CORE#19 74 75 74 75
CORE#20 72 75 74 74
CORE#21 77 76 77 77
CORE#22 77 76 77 77
CORE#23 77 76 77 77
CORE#24 77 76 77 78
 Apaltek

OCCT Real CPU Test - Intel i9-13900K Core CPU Processor

  • All the above tests did not activate the LED light source.
  • Select 'OCCT' as the test CPU pressure program.
  • This experiment was conducted in an open room temperature environment.
  • From the above results, it can be seen that the optimized CJS-360 has a 2-3 degree lower heat
  • dissipation performance than the pre optimized product.
Motherboard + CPU model Model CJS-360-1# CJS-360-2#
Platform machine test data AMD platform, CPU model: Ryzen 7950X, motherboard model: MSI X670-P CPU Power(W) 203.5 202.62
speed of the fan(RPM) 2200 2200
CPU average temperature (℃) 82.20  81.80 
Ambient temperature(℃) 23.6 23.5
Temperature difference(℃) 58.60  58.30 
Package 82.2 81.8
CPU core temperature (℃) CORE#0 0 0
CORE#1 0 0
CORE#2 0 0
Test Date Test time (min) CORE#3 0 0
CORE#4 0 0
2023/1/13 15 CORE#5 0 0
CORE#6 0 0
CORE#7 0 0
CORE#8 0 0
CORE#9 0 0
CORE#10 0 0
CORE#11 0 0
CORE#12 0 0
CORE#13 0 0
CORE#14 0 0
CORE#15 0 0
CORE#16 0 0
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OCCT Real CPU Test - Intel i9-13900K Core CPU Processor

  • All the above tests did not activate the LED light source.
  • Select 'Aida64' as the CPU stress test program.
  • This experiment was conducted in an open room temperature environment.
  • From the above results, it can be seen that the optimized CJS-360 has a 2-3 degree lower heat dissipation
  • performance than the pre optimized product.

Patent Introduction


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Explanation for China Patent Certificate

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Explanation for Taiwan Patent Certificate

Application product


PC gaming series

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