Technology
Apaltek Shenzhen Co.,Ltd.was founded in 2010, With a high-quality provider of the thermal management solutions which has integrated in R&D, manufacturing, selling and servicing, and leading position in semicoductor of CPU GPU
R&D capabilities
Customized services are committed to providing the best solutions for industry applications
Quick customization sample template
Complete hardware platform
Pre design services
Local design, manufacturing, and global services
Global Quality Assurance
Design Capability
Pump Design
- Adjust pump speed according to design requirements, Optimize the inlet and outlet water caliber of the pump to improve the water flow
- Optimize pump impeller group turbulence, increase static pressure
- Pump adopts ceramic bearing without noise
Structure Design
- Embedded system structure design
- Provide 3D design for products, architectures, parts, etc
- Optimum manufacturing design
- Mold design
- Standard and custom design for different sizes
- Tailor the design to meet the needs of the industry market
Fan Design
- Full range of DC fans,available in 40~140mm size.
- Design with excellent performance，Make the fan more flexible, more power saving, more silent, longer service life;
- All in one fan, its circuit and structure are superior, no patent issue, very suitable for 360 water-cooled pre-installed fan mode;
- The products comply with RoHS standards, and through the quality management system certification.
Systematic Design
- Heat dissipation design
- Simulating design
- Shorten the project development cycle
- Enable model complex systems
- Improve analysis efficiency
- Hardware and software integration optimization
Invention Patent
Invented by the United States+US10609841B2+a liquid cooling heat dissipation system and its liquid heat dissipation row
Invented by the United States+US11391520B2+liquid cooled heat dissipation device
American invention+US10697704B2+water-cooled cooling system and water storage tank
Invention+ZL201910091518.3+A water pump
Invention+ZL201910096769.0+A fluid cooling device
Invention+ZL22010668407.7+A liquid cooling heat dissipation device that can provide multiple heat sources for heat dissipation
Invention+ZL20211062355.5+A liquid cooled heat dissipation device
Invention+ZL202110584729.8+A heat pump air conditioning device and its implementation method
Invention+ZL202011172420. X+A liquid cooled heat absorbing block that is easy to expand and connect
Invention+ZL201611064376.4+A cooling and luminous fan device
Invention+ZL201810557252.2+a tubeless liquid cooling system
Invention+ZL201911127346.7+Liquid cooling device with composite flow channel
Invention+ZL201910744755.5+Liquid cooled heat dissipation device
Invention+certificate number I683208+tubeless liquid cooling and heat dissipation system
Invention+certificate number I683612+servo system with liquid cooling device
Invention+certificate number I695935+water pump
Invention+certificate number I686584+fluid cooling device
Invention+certificate number I707116+liquid cooling and heat dissipation device
Invention+certificate number I758781+liquid cooled heat dissipation device for multiple heat sources
Invention+certificate number I732486+dual pump module for liquid cooling devices
Invention+certificate number I731483+liquid cooling device with composite flow channel
Invention+I785409+easily expandable liquid cooled heat absorbing block
Invention+certificate number I787989+electric vehicle integrated thermal management system and implementation method
Invention+M631285+water-cooled cooling device
Invention+I800915+Heat Pump Air Conditioning Device and Its Implementation Method
Invented by the United States+US11800679B2+Integrated water-cooled cooling device (CIP)
Invention in the United States+US11802741B2+Fluid Cooling Device (PCT National Phase)
Utility model patent
Utility+M615525+liquid cooling structure with alternating cold and hot water discharge pipes
Utility+ZL2021206461948+A liquid cooling structure with alternating cold and hot water discharge pipes
Utility+ZL201320490375.1+A computer case with a projection module
Utility+ZL201721029589.3+integrated liquid cooling radiator
Utility+ZL201720435450.2+A luminescent heat dissipation water drain
Utility+ZL201820247478.8+A bidirectional pressure liquid cooling heat dissipation structure
Utility+ZL201820847335.0+An integrated liquid cooling system
Utility+ZL201821432129.X+A new type of luminescent structure water-cooled head
Utility+ZL201821432128.5+A multi-layer water pump impeller for heat dissipation system
Utility+ZL201920163916.7+A new type of leak proof and durable bearing fan
Utility+ZL201920164128. X+A fan blade and frame with shock-absorbing structure
Utility+M608916+fan blades and their fans that can be positively labeled
Utility+M607495+fan with display panel
Utility+M595785+integrated liquid cooling system
Utility+ZL202022007899.3+A fan with a display panel
Utility+ZL202022224003.7+A fan blade and its fan that can be positively labeled
Utility+ZL201621278068.7+A luminous fan device
Design patent
Design+ZL201830263251.8+Water cooling head
Design+ZL201830550259.2+Fan Frame
Design+ZL201930045517.6+flexible fan
Design+ZL201930045521.2+liquid cooled radiator
Design+ZL201930547772.0+water cooling head
Design+ZL202030196749.4+fan frame
Design+ZL202030405544.2+Fan
Apaltek
2907-2908, Building 2, OCT Creative Building, Minzhi Street, Longhua District, Shenzhen,China