Liquid Cooling Module-LCM TS2U-TL-80-2066
Pump located in the cold side (radiator) instead of the hot side.
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Product Details
Specifications
| Waterblock | Dimensions | 93*90*23mm | |
| Base | Copper | ||
| Principalpart | PPS | ||
| Pump | Model | A4 | |
| Voltage | 12V | ||
| Speed | 3000RPM | ||
| Radiator | Dimensions | 285*65*80mm | |
| Material | Aluminum | ||
| Tube | Dimensions | Φ13*400mm | |
| Material | EPDM | ||
| Fan | Dimensions | 80*80*38mm | |
| Voltage | 12V | ||
| Speed | 6000RPM | ||
| Air flow{max} | 83.04CFM | ||
| Prerssure{max} | 21.87mm/H20 | ||
| Noise | 55 dBA | ||
| Quantity | 2Pcs | ||
| Power dissipation | 300w | ||
| Compatible Socket&CPU | Intel 2066 | ||
FEATURES
• Pump located in the cold side (radiator) instead of the hot side.
• (W/B) may avoid the damages from the high-temperature coolant.
• Pump located in the radiator instead of the waterblock may avoid the vibrative damages to the chipsets.
• Compared with air cooling solution in high power servers, quid solution considerably re duce its own operational power and noise when it meets the same thermal dissipation target.
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