Liquid Cooling Module-LCM U1000
The water-cooled liquid of the heat dissipation module flows in parallel to maintain a uniform temperature.
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Specifications
| Waterblock | Dimensions | 108*81*24.8mm | |
| Base | Aluminum | ||
| Principalpart | Copper | ||
| Pump | Model | A1 | |
| Voltage | 12V | ||
| Speed | 3200±10%RPM | ||
| Radiator | Dimensions | 1U&2&3U&4U | |
| Material | Aluminum | ||
| Tube | Dimensions | Φ10*400mm | |
| Material | PTFE | ||
| Power dissipation | 1000w | ||
| Compatible Socket&CPU | Intel 4189&4677 AMD SP5&SP6 | ||
FEATURES
• The water-cooled plate of the heat dissipation module is fixed by a combination of steel and aluminum, the steel plate is adhered to the chip, and the aluminum bracket is fixed on the PCB board;
• Metal nuts are used for fixing water pipes, which can withstand high-pressure working environments;
• The heat dissipation module adopts vacuum brazing welding, which has high sealing performance and reduces the evaporation of water-cooled liquid;
• The water-cooled liquid of the heat dissipation module flows in parallel to maintain a uniform temperature.
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Apaltek
2907-2908, Building 2, OCT Creative Building, Minzhi Street, Longhua District, Shenzhen,China