Liquid Cooling Module-LCM TS4U-SP5
Adopt pure copper brazing process to ensure no leakage.
Category:
Keywords:
Product Details
Specifications
| Waterblock | Dimensions | 118*92.4*25.4mm | |
| Base | Copper | ||
| Principalpart | Aluminum | ||
| Pump | Model | A2 | |
| Voltage | 12V | ||
| Speed | 4000RPM | ||
| Radiator | Dimensions | 396*120*27mm | |
| Material | Aluminum | ||
| Tube | Dimensions | OD13mm | |
| Material | EPDM | ||
| Fan | Dimensions | 120*120*25mm | |
| Voltage | 12V | ||
| Speed | 2000RPM | ||
| Air flow{max} | 78.73CFM | ||
| Prerssure{max} | 2.39mm/H20 | ||
| Noise | 34.3 dBA | ||
| Quantity | 3Pcs | ||
| Power dissipation | 500w | ||
| Compatible Socket&CPU | AMD SP5(Genoa) | ||
FEATURES
• Adopt pure copper brazing process to ensure no leakage.
• Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces.
• The size of the radiator can be flexibly adjusted to meet various specifications of the server chassis; For example, 1U, 2U, 3U, 4U.
Related products
Online Message
*Note: Please make sure to fill in the information accurately and maintain smooth communication. We will contact you as soon as possible
Apaltek
2907-2908, Building 2, OCT Creative Building, Minzhi Street, Longhua District, Shenzhen,China