Server Opened-Loop Series T4
Adopt pure copper brazing process to ensure no leakage.
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Specifications
| Waterblock | Dimensions | 118*78*25.5mm | |
| Base | Copper | ||
| Principalpart | Aluminum | ||
| Tube | Dimensions | Φ 10*400mm | |
| Material | PTFE | ||
| Power dissipation | 700w | ||
| Compatible Socket&CPU | Intel LGA 4677 | ||
FEATURES
• Adopt pure copper brazing process to ensure no leakage.
• Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces.
• A copper pagoda-shaped spout,CNC precision-machined.
• In all copper cold plates,Nickel plating on the whole surface.
• It is mainly used for server/Data center (it can meet 4677, 4189, 3647, TR4 , SP5 and other standard platforms, and can be customized for non-standard platforms).
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Apaltek
2907-2908, Building 2, OCT Creative Building, Minzhi Street, Longhua District, Shenzhen,China